PCB Product Catalog
High-Quality Solutions for Packaging Test, Industrial Control, Medical, and High-Reliability Applications
- Plate thickness: 4.5mm
- Plate: S1000-2M
- Line width/line spacing: 8/9MIL
- Minimum aperture: 0.4mm
- Surface technology: Gold Deposition
- Process characteristics: Thick copper, Plate hole metal 30U"
- Plate thickness: 5.5mm
- Sheet: EM-370 (Z)
- Line width/line spacing: 5.9/5.9mil
- Minimum hole: 0.25mm
- Surface technology: Whole Board Electric
- Process characteristics: Multilayer thermoelectric separation
- Plate thickness: 3.8mm
- Plate: FR4+Red Copper
- Line width/line spacing: 3/3mil
- Minimum hole: 0.4mm
- Surface technology: Gold Deposition
- Process characteristics: 4th stage HDI hole stacking
- Plate thickness: 1.6mm
- Plate: S1000-2M
- Line width/line spacing: 6/3mil
- Minimum hole: 0.3mm
- Surface technology: Gold Deposition
- Process features: 5th order arbitrary half hole, depth control & capping
- Plate thickness: 3.2mm
- Plate: F4BME-1/2+Rogers4450 PP
- Line width/line spacing: 12/14mil
- Minimum hole: 0.6mm
- Surface technology: Gold Deposition
- Process features: Step plate, metal edging
- Plate thickness: 1.6mm (6-layer rigid board)
- Plate: R-F777+S1000-2M
- Line width/line spacing: 4/4mil
- Minimum hole: 0.2mm
- Surface technology: Gold Deposition
- Process characteristics: Rigid-flexible interconnection combination
- Plate thickness: 1.6mm
- Plate: S1000-2M
- Line width/line spacing: 5/5mil
- Minimum hole: 0.3mm
- Surface technology: Gold Deposition
- Process features: High-precision manufacturing
- Plate thickness: 3.0mm
- Plate: FR4
- Line width/line spacing: 8/8mil
- Minimum hole: 0.4mm
- Surface technology: Gold Deposition
- Process features: Stable high-temperature resistance
- Plate thickness: 2.0mm
- Plate: Rogers 4450
- Line width/line spacing: 4/4mil
- Minimum hole: 0.25mm
- Surface technology: Gold Plating
- Process features: Low loss high-frequency performance
PCBA Assembly Services
Specialized Assembly for Security, Surveillance & Industrial Electronics
- High durability for field use
- Compact design for portability
- Stable signal transmission
- 4K video processing support
- Low-power for 24/7 operation
- Anti-interference signal design
- Integrated lens & sensor module
- Wireless transmission capability
- Small form factor
Manufacturing Equipment
State-of-the-Art Production Facilities
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Developing Machine
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Automatic Line
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Equipment
SMT Equipment Showcase
State-of-the-Art SMT Production Line Equipment
Equipment Detail
×Key Specifications (From Summaries)
Product Application Fields
High-performance components for diverse industrial applications
Network Communication
Stable signal transmission, anti-interference design, suitable for 5G base stations, routers.
Automotive Electronics
High temperature resistance, anti-interference, applied in vehicle navigation, autonomous driving sensors.
Automation Equipment
High precision, improves production efficiency, used for industrial robots, intelligent production lines.
Medical Electronics
High reliability, high precision, applicable to medical monitors, diagnostic equipment.
Optical Storage New Energy
Efficient energy conversion, suitable for solar photovoltaic, energy storage batteries, charging piles.
Industrial Control
Stable operation, compatible with PLC, frequency converters, industrial instruments.
Quality Control
Strict Standard System for PCB Quality Assurance
Raw Material Inspection
All raw materials are verified against international standards before arrangement. We cross-check material certificates to avoid hidden material risks for your projects.
In-Process Control
Unified inspection standards apply throughout all processing stages. Continuous quality tracking keeps stable and uniform board performance.
Electrical Testing
All finished PCBs go through open-short, impedance and continuity tests to reduce circuit failure risks after shipment.
Dimensional & Visual Check
Precise measurement and visual inspection cover thickness, outline, pads, solder mask and silkscreen to meet your custom specs.
Reliability Testing
Thermal shock, solderability and environmental tests are available to support industrial and automotive electronic applications.
Final Pre-Shipment Audit
Every order is fully reviewed before delivery. We recheck technical specs, packaging and order details to match your quality requirements.
Process Capability
Precision Manufacturing Standards
| Layer | 1-60Layers |
|---|---|
| Material | FR4,HTC, halogen free, metal substrate, high frequency material, High Speed Material, High CTI |
| Board thickness | 0.4mm-8.0mm |
| Min board size | 10×10mm |
| Max board size | 622mm×1200mm |
| Board thickness tolerance | ≤1.0mm, +/-0.1mm; ≥1.0mm, +/-10% |
| Copper Thickness | 0.33oz-30oz |
| Min Trace Width | 2mil(0.05mm) |
| Min Spacing | 2mil(0.05mm) |
| Min Drilling Dia | 0.10mm |
| PTH copper thickness | 0.4-2mil(10-50um) |
|---|---|
| Line width tolerance | ±20% |
| V-cut angle | 25°, 30°, 45°, 60° |
| Peel Strength of Line | ≥6lb/in(≥107g/mm) |
| Impedance control and tolerance | ±10% |
| Twist & Warp | ≤ 0.75% |
| Soldermask Color | Green, Red, Blue, White, Black, Yellow |
| Surface Finish/Plating | Chemical gold plating, gold plating, chemical tin plating, chemical silver plating, anti-oxidation treatment and tin spraying, electroplated gold finger, NiPdAu |
| Maximum Aspect Ratio | 25:1 |
| Hole Types | Through hole, blind hole, buried hole, counterbore, PTH pan hole, Backdrill, Step hole |
Product Delivery Date
Efficient and Reliable PCB Delivery Schedule
| Sample Processing Time | Batch Processing Time | |||
|---|---|---|---|---|
| Type | Fastest Delivery | Normal Delivery | Type | Delivery Date |
| Double Sided Board | 24 Hours | 3 Days | Double Sided Board | 7 Days |
| 4-Layer Laminate | 36 Hours | 5 Days | 4-Layer Laminate | 10 Days |
| 6-Layer Laminate | 48 Hours | 6 Days | 6-Layer Laminate | 12 Days |
| 8-Layer Laminate | 72 Hours | 7 Days | 8-Layer Laminate | 12 Days |
| 10-Layer Laminate | 4 Days | 9 Days | 10-Layer Laminate | 14 Days |
| 12-Layer Laminate | 4 Days | 11 Days | 12-Layer Laminate | 16 Days |
| 14-Layer Laminate | 5 Days | 13 Days | 14-Layer Laminate | 16 Days |
| 16-Layer Laminate | 5 Days | 15 Days | 16-Layer Laminate | 18 Days |
| 18 Layers & Above | To Be Negotiated | To Be Negotiated | 18 Layers & Above | 18 Days |